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You are here: Home » Electronic Component Suppliers » United Chemi-con  » High Density Mounting Assembly

High Density Mounting Assembly

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Introduction

We will correspond consistently from the design like the high density mounting substrate and the micro high frequency module, etc. United Chemi-con

Features

  • The consolidation correspondence of the C4 chip is possible.
  • Parts such as semiconductors including C.R parts can be procured.
  • It is possible in all substrates from PCB to FPC equipped with parts.

Click here to order High Density Mounting Assembly samples from United Chemi-con.

 

 

 
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