Introduction
NEC's feature rich, high-density cell-based ASICs are needed in your high-volume projects. NEC provides the options needed for high performance system-level integration with leading ASIC process technology and embedded DRAM.
Benefits:
- Highest performance, power and integration
- Cell-based ASICs are offered with a selection of IP cores. They are perfect for high-volume designs that require the highest density and performance. They are available in a range of process technologies, from mature through leading, edge
- Max. clock speed: Up to 1 GHz
- Memory: High-density SRAM and embedded DRAM
- Signal I/Os: Up to 1400
- Usable ASIC gates: Up to 100M
- Featured IP: ARM CPUs, Tensilica CPUs and DSPs, USB 2.0, eDRAM, SerDes, PCI Express, SATA/SAS, SPI4.2
IP Core
There are a large number of IP cores in cell-based ICs, including CPU cores and analog logic cores. Customers are supported in their own system chip design development by these options.
A wide array of options, including NEC Electronics original V850E core, standard ARM cores used as embedded CPUs in mobile equipment, and MIPS™ cores for high-end applications are offered by NEC Electronics lineup of CPU cores for system chips or SoC development. Some of the cores available from NEC Electronics are listed below.
Core List
- Digital Core
- Analog Core
- SRAM
- eDRAM
- I/O
Services Provided During Cell-Based IC Development
Linked processes from logic design to manufacturing feature at NEC Electronics in production of cell-based ICs. This helps in providing an environment for short turnaround time in mass-producing LSIs. Large-scale integration, advanced performance, and low power consumption are featured in these LSIs.
Benefits:
- Logic design taking layout design into account at an early stage
- Layout design taking manufacturing (DFY or DFM) into account
- Test design improving manufacturing quality
- Feedback from manufacturing to logic design and test design
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